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A chip inside your phone starts a long way from your pocket. Minerals become purified material, then wafers, then tiny circuits. Testing, packaging and assembly turn those circuits into something you can use.
There is a second path, too: someone has to design what the chip will do. The map below brings both paths together. Start with the whole journey, then open only the parts you want to explore.
Follow a chip’s journey
Follow the arrows to see what moves. Choose a step to see what changes and who does the work.
- 1Purify the materialQuartz → pure silicon
- 2Make a waferPure silicon → smooth disc
- 3Build the circuitsWafer + blueprint → circuits
- 4Test and protectCircuits → usable chips
- 5Put chips to workChips → products and services
→ Materials and products follow the numbered path. The design arrives separately.
Purify the material
Quartz → pure silicon
A silicon chip starts with quartz, a mineral containing silicon. Refiners turn it into silicon and remove impurities that could spoil a circuit.
- Comes in
- Quartz and other mineral sources
- Leaves this step
- Very pure silicon, plus gases and metals
Who takes part?
Explore each role below. A company can take part in more than one step.
Minerals, silicon and gasesSibelco · The Quartz Corp · Wacker Chemie
Suppliers refine silicon, provide pure quartz for crystal-growing containers, and supply the gases and metals factories need.
- Air LiquideElectronics gases and advanced moleculesFrance
- DOWA HoldingsMinerals, silicon and gasesJapan
- ElkemMinerals, silicon and gasesNorway
- FerroglobeMinerals, silicon and gasesUnited Kingdom
- Hemlock SemiconductorPolysiliconUnited States
- LindeBulk and rare gasesUnited Kingdom
- Nippon Sanso HoldingsMinerals, silicon and gasesJapan
- SibelcoHigh-purity quartz for crystal-growing cruciblesBelgium
- The Quartz CorpHigh-purity quartzNorway
- Wacker ChemieElectronic-grade polysiliconGermany
Make a wafer
Pure silicon → smooth disc
A wafer maker grows a large silicon crystal, slices it into thin discs, and polishes them. Each disc is a wafer: the surface on which many chips will be built.
- Comes in
- Purified silicon
- Leaves this step
- Blank, polished wafers
Who takes part?
Explore each role below. A company can take part in more than one step.
Wafer makersShin-Etsu Chemical · SUMCO · GlobalWafers
These companies grow crystals and turn them into clean, flat wafers. Some supply other materials, such as silicon carbide, for specialised chips.
- AXTGaAs, InP and germanium substratesUnited States
- CoherentWafer makersUnited States
- EV GroupWafer makersAustria
- GlobalWafersSilicon wafersTaiwan
- IQECompound-semiconductor epitaxyUnited Kingdom
- Shin-Etsu ChemicalSilicon wafersJapan
- SICCWafer makersChina
- SicSemWafer makersIndia
- SiltronicSilicon wafersGermany
- SK SiltronSilicon and SiC wafersSouth Korea
- SoitecEngineered SOI substratesFrance
- SUMCOSilicon and epitaxial wafersJapan
- TankeBlueWafer makersChina
- WolfspeedSiC materials and devicesUnited States
Draw the circuit
An idea → a blueprint
In parallel, designers decide what the chip should do. They combine reusable circuit blocks, connect them, and use software to check the design before sending it to a factory.
- Comes in
- A product idea and reusable circuit designs
- Leaves this step
- A checked circuit layout
Who takes part?
Explore each role below. A company can take part in more than one step.
Chip designersNVIDIA · AMD · Qualcomm
Design teams choose the chip’s job, plan its circuits and check that they work together.
- AlphabetChip designersUnited States
- AmazonChip designersUnited States
- AMDCPUs and GPUsUnited States
- Analog DevicesMixed-signal devicesUnited States
- AppleChip designersUnited States
- Axelera AIChip designersNetherlands
- BaiduChip designersChina
- BoschChip designersGermany
- BroadcomNetworking and custom siliconUnited States
- BYDChip designersChina
- CDILChip designersIndia
- Celestial AIChip designersUnited States
- CerebrasChip designersUnited States
- CXMTChip designersChina
- CyientChip designersIndia
- d-MatrixChip designersUnited States
- GroqChip designersUnited States
- HailoChip designersIsrael
- HCLTechChip designersIndia
- HuaweiChip designersChina
- InfineonChip designersGermany
- IntelChip designersUnited States
- KioxiaChip designersJapan
- L&T Technology ServicesChip designersIndia
- LightmatterChip designersUnited States
- MarvellChip designersUnited States
- MediaTekMobile and edge systemsTaiwan
- MetaChip designersUnited States
- Microchip TechnologyChip designersUnited States
- MicronChip designersUnited States
- MicrosoftChip designersUnited States
- Mindgrove TechnologiesIndian embedded SoCsIndia
- MosChipDesign services and silicon IPIndia
- NVIDIAGPUs, AI accelerators and system platformsUnited States
- NXPChip designersNetherlands
- onsemiChip designersUnited States
- QualcommMobile, connectivity and computeUnited States
- RenesasChip designersJapan
- ROHMChip designersJapan
- Samsung ElectronicsChip designersSouth Korea
- SandiskChip designersUnited States
- Sankalp SemiconductorChip designersIndia
- SignalchipChip designersIndia
- SiMa.aiChip designersUnited States
- SK hynixChip designersSouth Korea
- STMicroelectronicsChip designersSwitzerland
- SyntiantChip designersUnited States
- TenstorrentChip designersUnited States
- TeslaChip designersUnited States
- TessolveChip designersIndia
- Texas InstrumentsAnalogue and embedded processingUnited States
- WiproChip designersIndia
- WolfspeedChip designersUnited States
- YMTCChip designersChina
Reusable circuit blocksArm · Synopsys · Cadence
Instead of drawing everything from scratch, designers can license proven blocks, such as processor cores and interfaces.
- Alphawave SemiReusable circuit blocksUnited Kingdom
- Andes TechnologyRISC-V processor IPTaiwan
- ArmProcessor designs and software ecosystemUnited Kingdom
- ArterisReusable circuit blocksUnited States
- CadenceInterface and processor IPUnited States
- Celestial AIReusable circuit blocksUnited States
- eMemoryReusable circuit blocksTaiwan
- Imagination TechnologiesGPU IPUnited Kingdom
- InCore SemiconductorsIndian RISC-V IPIndia
- LightmatterReusable circuit blocksUnited States
- MosChipReusable circuit blocksIndia
- RambusMemory and security interfacesUnited States
- SiFiveRISC-V processor IPUnited States
- SilvacoReusable circuit blocksUnited States
- SynopsysInterface and memory IPUnited States
- TenstorrentReusable circuit blocksUnited States
Design softwareSynopsys · Cadence · Siemens
Electronic design automation (EDA) tools help engineers draw, simulate and check a circuit before it is made.
- CadenceDesign, verification, emulation and system analysisUnited States
- SiemensEDA including verification, physical design and emulationGermany
- SilvacoTCAD and design softwareUnited States
- SynopsysDesign, verification, TCAD and IP; acquired AnsysUnited States
- YosysHQOpen synthesis and formal-verification toolingAustria
Build the circuits
Wafer + blueprint → circuits
Inside a chip factory, called a fab, machines build tiny circuits on the wafer. They add layers, print patterns, remove selected material, and repeat. Chemicals clean and shape the layers along the way.
- Comes in
- Blank wafers, circuit layouts, chemicals and machines
- Leaves this step
- A wafer carrying many individual chips
Who takes part?
Explore each role below. A company can take part in more than one step.
Chip factoriesTSMC · Samsung Electronics · Intel
Foundries make chips for customers. Integrated device manufacturers design and manufacture their own chips, and may also make chips for others.
- Analog DevicesChip factoriesUnited States
- BoschChip factoriesGermany
- CDILChip factoriesIndia
- CXMTChip factoriesChina
- DB HiTekChip factoriesSouth Korea
- GlobalFoundriesSpecialty and mature-node foundryUnited States
- InfineonChip factoriesGermany
- IntelIDM and external foundryUnited States
- KioxiaChip factoriesJapan
- Microchip TechnologyChip factoriesUnited States
- MicronMemory fabricationUnited States
- NXPChip factoriesNetherlands
- onsemiChip factoriesUnited States
- PSMCChip factoriesTaiwan
- RapidusChip factoriesJapan
- RenesasChip factoriesJapan
- ROHMChip factoriesJapan
- Samsung ElectronicsFoundry and memorySouth Korea
- SandiskChip factoriesUnited States
- Semi-Conductor LaboratoryChip factoriesIndia
- SicSemChip factoriesIndia
- SK hynixMemory fabricationSouth Korea
- SMICLogic foundryChina
- STMicroelectronicsChip factoriesSwitzerland
- Tata ElectronicsAnnounced Dholera foundryIndia
- Texas InstrumentsChip factoriesUnited States
- Tower SemiconductorSpecialty foundryIsrael
- TSMCLogic foundry and advanced packagingTaiwan
- UMCMature and specialty foundryTaiwan
- Vanguard International SemiconductorChip factoriesTaiwan
- WolfspeedChip factoriesUnited States
- YMTCChip factoriesChina
Pattern templatesHOYA · AGC · Photronics
Photomasks carry the patterns used to print circuit layers. Suppliers make the templates and the tools that write and inspect them.
- AGCGlass and mask materialsJapan
- Dai Nippon PrintingPhotomasksJapan
- HOYAEUV and DUV mask blanksJapan
- IMS NanofabricationMulti-beam mask writersAustria
- LasertecEUV mask inspectionJapan
- NuFlare TechnologyElectron-beam mask writersJapan
- PhotronicsMerchant photomasksUnited States
- Shin-Etsu ChemicalPattern templatesJapan
Factory machinesASML · Nikon · Canon
Different machines print patterns, add and remove material, polish surfaces, and look for defects.
- Advanced EnergyFactory machinesUnited States
- AixtronFactory machinesGermany
- AMECEtch and depositionChina
- Applied MaterialsMaterials engineering, deposition and process toolsUnited States
- ASM InternationalDepositionNetherlands
- ASMLEUV and DUV lithographyNetherlands
- AxcelisFactory machinesUnited States
- Brooks AutomationFactory machinesUnited States
- CanonDUV lithography and nanoimprintJapan
- CoherentFactory machinesUnited States
- Edwards VacuumVacuum and abatementUnited Kingdom
- Hitachi High-TechFactory machinesJapan
- KLAProcess control, inspection and metrologyUnited States
- Lam ResearchEtch, deposition and cleanUnited States
- LasertecFactory machinesJapan
- MKS InstrumentsFactory machinesUnited States
- NAURAFactory machinesChina
- NikonDUV lithographyJapan
- Onto InnovationFactory machinesUnited States
- SCREEN HoldingsFactory machinesJapan
- Tokyo ElectronCoat/develop, etch and depositionJapan
- TRUMPFEUV drive lasersGermany
- VAT GroupFactory machinesSwitzerland
- VeecoFactory machinesUnited States
- ZEISSEUV opticsGermany
Chemicals used along the wayTokyo Ohka Kogyo · JSR · Fujifilm
Light-sensitive coatings help print patterns. Other chemicals and gases clean, etch, deposit and polish the wafer throughout manufacturing.
- AGCChemicals used along the wayJapan
- Air LiquideChemicals used along the wayFrance
- DOWA HoldingsChemicals used along the wayJapan
- EntegrisCMP, filtration and contamination controlUnited States
- FujifilmResists, CMP slurries and wet chemicalsJapan
- JSRLeading-edge resistsJapan
- Kanto ChemicalChemicals used along the wayJapan
- LindeChemicals used along the wayUnited Kingdom
- Merck KGaAElectronic materialsGermany
- Nippon Sanso HoldingsChemicals used along the wayJapan
- Qnity ElectronicsFormer DuPont electronics materialsUnited States
- ResonacSemiconductor and packaging materialsJapan
- Shin-Etsu ChemicalChemicals used along the wayJapan
- Stella ChemifaHigh-purity fluoride chemicalsJapan
- Sumitomo ChemicalChemicals used along the wayJapan
- Tokyo Ohka KogyoPhotoresists and lithography chemicalsJapan
Test and protect
Circuits → usable chips
Tests find which circuits work. The wafer is cut into individual chips, called dies. Packaging connects and protects them; some packages combine several dies. Final tests check that the package performs as intended.
- Comes in
- Patterned wafers and packaging materials
- Leaves this step
- Tested, connected, protected chips
Who takes part?
Explore each role below. A company can take part in more than one step.
Test before cuttingFormFactor · Technoprobe · Micronics Japan
Probes touch the circuits on a wafer and check them electrically. The results identify working dies and help the factory reduce defects.
- FormFactorProbe cards and analytical testUnited States
- Japan Electronic MaterialsProbe cardsJapan
- KLATest before cuttingUnited States
- Micronics JapanProbe cardsJapan
- MPI CorporationProbing and test systemsTaiwan
- PDF SolutionsYield and manufacturing analyticsUnited States
- TechnoprobeProbe cardsItaly
- TessolveTest engineering servicesIndia
Cut, connect and protectTSMC · ASE Technology · Amkor
Assembly companies cut wafers, connect dies and build packages. Material and equipment suppliers provide the film, substrates and bonding tools they use.
- 3D Glass SolutionsCut, connect and protectUnited States
- AjinomotoABF insulating filmJapan
- AmkorOSAT and advanced packagingUnited States
- Applied MaterialsCut, connect and protectUnited States
- ASE TechnologyOSAT and advanced packagingTaiwan
- ASMPTCut, connect and protectSingapore
- BesiDie attach and hybrid bondingNetherlands
- CG SemiIndian OSATIndia
- DISCODicing and grindingJapan
- EV GroupWafer bondingAustria
- IbidenPackage substratesJapan
- IntelCut, connect and protectUnited States
- JCETOSATChina
- Kaynes TechnologyIndian packaging and modulesIndia
- Kulicke & SoffaCut, connect and protectSingapore
- MicronCut, connect and protectUnited States
- Nan Ya PCBCut, connect and protectTaiwan
- Onto InnovationCut, connect and protectUnited States
- Powertech TechnologyCut, connect and protectTaiwan
- Qnity ElectronicsCut, connect and protectUnited States
- ResonacCut, connect and protectJapan
- Sahasra SemiconductorsCut, connect and protectIndia
- Samsung ElectronicsCut, connect and protectSouth Korea
- Shinko Electric IndustriesPackage substratesJapan
- SK hynixCut, connect and protectSouth Korea
- Tata ElectronicsCut, connect and protectIndia
- TSMCCoWoS and 3D integrationTaiwan
- UTACCut, connect and protectSingapore
Check the finished chipAdvantest · Teradyne · Cohu
Test machines check function, speed and power. Some chips also face heat or electrical stress to check reliability.
- AdvantestSoC and memory ATEJapan
- Aehr Test SystemsWafer and package burn-inUnited States
- AmkorAssembly and test servicesUnited States
- ASE TechnologyCheck the finished chipTaiwan
- CG SemiCheck the finished chipIndia
- Chroma ATETest and measurementTaiwan
- CohuTest handlers, contactors and test solutionsUnited States
- JCETCheck the finished chipChina
- Kaynes TechnologyCheck the finished chipIndia
- MicronCheck the finished chipUnited States
- Powertech TechnologyCheck the finished chipTaiwan
- Sahasra SemiconductorsCheck the finished chipIndia
- TeradyneSemiconductor ATEUnited States
- TessolveTest engineeringIndia
- UTACCheck the finished chipSingapore
Put chips to work
Chips → products and services
Manufacturers mount chips on circuit boards and build phones, cars, medical equipment and servers. Software makes the hardware useful. Cloud operators use servers to deliver computing and AI services.
- Comes in
- Packaged chips, boards and software
- Leaves this step
- Devices and computing services people use
Who takes part?
Explore each role below. A company can take part in more than one step.
Boards and assembliesFoxconn · Quanta Computer · Wistron
Electronics manufacturers solder chips onto boards and combine them with power, networking and cooling components.
- Avalon TechnologiesBoards and assembliesIndia
- Dixon TechnologiesIndian electronics manufacturingIndia
- FlexManufacturing and integrationUnited States
- FoxconnElectronics and AI-server manufacturingTaiwan
- InventecBoards and assembliesTaiwan
- JabilManufacturing and engineeringUnited States
- Kaynes TechnologyIndian EMS and modulesIndia
- Nan Ya PCBBoards and assembliesTaiwan
- NVIDIABoards and assembliesUnited States
- Quanta ComputerServer and computer ODMTaiwan
- SanminaElectronics manufacturingUnited States
- Syrma SGSIndian EMSIndia
- Tata ElectronicsBoards and assembliesIndia
- WistronElectronics manufacturingTaiwan
- WiwynnCloud and AI systemsTaiwan
Finished productsApple · Dell · Cisco
Product companies combine electronics and software into complete systems, from phones to vehicles and medical equipment.
- ABBFinished productsSwitzerland
- AirbusAerospace systemsNetherlands
- AppleConsumer devices and internal chip designUnited States
- Arista NetworksFinished productsUnited States
- Ashok LeylandCommercial vehicles and iALERTIndia
- Bharat ElectronicsDefence electronicsIndia
- BharatBenzCommercial vehicles and TruckonnectIndia
- BoeingFinished productsUnited States
- BoschVehicle electronics and sensorsGermany
- BYDFinished productsChina
- CiscoNetworking systemsUnited States
- ContinentalFinished productsGermany
- Daimler TruckFinished productsGermany
- DellComputers and serversUnited States
- EricssonTelecom systemsSweden
- GE HealthCareMedical systemsUnited States
- HoneywellFinished productsUnited States
- HPFinished productsUnited States
- HPEFinished productsUnited States
- HuaweiFinished productsChina
- LenovoFinished productsChina
- Mahindra & MahindraFinished productsIndia
- MedtronicFinished productsIreland
- NokiaFinished productsFinland
- PACCARFinished productsUnited States
- PhilipsFinished productsNetherlands
- Samsung ElectronicsFinished productsSouth Korea
- Schneider ElectricFinished productsFrance
- SupermicroFinished productsUnited States
- Tata MotorsCommercial vehicles and Fleet EdgeIndia
- Tejas NetworksFinished productsIndia
- TeslaFinished productsUnited States
- ToyotaFinished productsJapan
- VE Commercial VehiclesConnected commercial vehiclesIndia
- VolkswagenFinished productsGermany
- Volvo GroupFinished productsSweden
- XiaomiFinished productsChina
- ZTEFinished productsChina
Computing and AI servicesAlphabet · Microsoft · Amazon
Cloud operators run servers; AI companies use computing to train and run models. These companies create demand for chips rather than all manufacturing them.
- AlphabetCloud, models and custom computeUnited States
- AmazonAWS and TrainiumUnited States
- AnthropicAI models and compute demandUnited States
- BaiduComputing and AI servicesChina
- CerebrasComputing and AI servicesUnited States
- CoreWeaveSpecialist AI cloudUnited States
- CtrlSComputing and AI servicesIndia
- GroqComputing and AI servicesUnited States
- LambdaComputing and AI servicesUnited States
- MetaAI workloads and internal computeUnited States
- MicrosoftCloud and AI infrastructureUnited States
- Mistral AIComputing and AI servicesFrance
- NebiusAI infrastructureNetherlands
- NscaleComputing and AI servicesUnited Kingdom
- NVIDIAComputing and AI servicesUnited States
- OpenAIModel and compute demandUnited States
- OracleCloud infrastructureUnited States
- Reliance IndustriesComputing and AI servicesIndia
- SifyComputing and AI servicesIndia
- TencentComputing and AI servicesChina
- YottaIndian cloud and AI infrastructureIndia
The customers behind demandState Bank of India · Walmart · FedEx
Businesses and consumers buy the products and services. Their needs and budgets influence orders throughout the chain.
- DHL GroupLogistics and enterprise systemsGermany
- FedExFleet and logistics systemsUnited States
- Reliance IndustriesTelecom, retail and digital infrastructure demandIndia
- State Bank of IndiaEnterprise and financial-service technology demandIndia
- WalmartRetail and logistics technology useUnited States
Three things to remember
- The blueprint and the material take different paths. Designers send a layout; wafer makers send a physical disc. They meet at the fab.
- A chip needs more than a factory. Specialised machines, chemicals, testing and packaging make the design usable.
- One company can wear several hats. Some design chips, others manufacture them, and some do both. A device or cloud company may also design its own chips.
That is the value chain: each step turns someone else’s work into something the next step can use.
Find a company
Looking for a particular name? Search the directory or browse by role.
Explore all companies
- 3D Glass SolutionsUnited States
- ABBSwitzerland
- Advanced EnergyUnited States
- AdvantestJapan
- Aehr Test SystemsUnited States
- AGCJapan
- Air LiquideFrance
- AirbusNetherlands
- AixtronGermany
- AjinomotoJapan
- AlphabetUnited States
- Alphawave SemiUnited Kingdom
- AmazonUnited States
- AMDUnited States
- AMECChina
- AmkorUnited States
- Analog DevicesUnited States
- Andes TechnologyTaiwan
- AnthropicUnited States
- AppleUnited States
- Applied MaterialsUnited States
- Arista NetworksUnited States
- ArmUnited Kingdom
- ArterisUnited States
- ASE TechnologyTaiwan
- Ashok LeylandIndia
- ASM InternationalNetherlands
- ASMLNetherlands
- ASMPTSingapore
- Avalon TechnologiesIndia
- AxcelisUnited States
- Axelera AINetherlands
- AXTUnited States
- BaiduChina
- BesiNetherlands
- Bharat ElectronicsIndia
- BharatBenzIndia
- BoeingUnited States
- BoschGermany
- BroadcomUnited States
- Brooks AutomationUnited States
- BYDChina
- CadenceUnited States
- CanonJapan
- CDILIndia
- Celestial AIUnited States
- CerebrasUnited States
- CG SemiIndia
- Chroma ATETaiwan
- CiscoUnited States
- CoherentUnited States
- CohuUnited States
- ContinentalGermany
- CoreWeaveUnited States
- CtrlSIndia
- CXMTChina
- CyientIndia
- d-MatrixUnited States
- Dai Nippon PrintingJapan
- Daimler TruckGermany
- DB HiTekSouth Korea
- DellUnited States
- DHL GroupGermany
- DISCOJapan
- Dixon TechnologiesIndia
- DOWA HoldingsJapan
- Edwards VacuumUnited Kingdom
- ElkemNorway
- eMemoryTaiwan
- EntegrisUnited States
- EricssonSweden
- EV GroupAustria
- FedExUnited States
- FerroglobeUnited Kingdom
- FlexUnited States
- FormFactorUnited States
- FoxconnTaiwan
- FujifilmJapan
- GE HealthCareUnited States
- GlobalFoundriesUnited States
- GlobalWafersTaiwan
- GroqUnited States
- HailoIsrael
- HCLTechIndia
- Hemlock SemiconductorUnited States
- Hitachi High-TechJapan
- HoneywellUnited States
- HOYAJapan
- HPUnited States
- HPEUnited States
- HuaweiChina
- IbidenJapan
- Imagination TechnologiesUnited Kingdom
- IMS NanofabricationAustria
- InCore SemiconductorsIndia
- InfineonGermany
- IntelUnited States
- InventecTaiwan
- IQEUnited Kingdom
- JabilUnited States
- Japan Electronic MaterialsJapan
- JCETChina
- JSRJapan
- Kanto ChemicalJapan
- Kaynes TechnologyIndia
- KioxiaJapan
- KLAUnited States
- Kulicke & SoffaSingapore
- L&T Technology ServicesIndia
- Lam ResearchUnited States
- LambdaUnited States
- LasertecJapan
- LenovoChina
- LightmatterUnited States
- LindeUnited Kingdom
- Mahindra & MahindraIndia
- MarvellUnited States
- MediaTekTaiwan
- MedtronicIreland
- Merck KGaAGermany
- MetaUnited States
- Microchip TechnologyUnited States
- MicronUnited States
- Micronics JapanJapan
- MicrosoftUnited States
- Mindgrove TechnologiesIndia
- Mistral AIFrance
- MKS InstrumentsUnited States
- MosChipIndia
- MPI CorporationTaiwan
- Nan Ya PCBTaiwan
- NAURAChina
- NebiusNetherlands
- NikonJapan
- Nippon Sanso HoldingsJapan
- NokiaFinland
- NscaleUnited Kingdom
- NuFlare TechnologyJapan
- NVIDIAUnited States
- NXPNetherlands
- onsemiUnited States
- Onto InnovationUnited States
- OpenAIUnited States
- OracleUnited States
- PACCARUnited States
- PDF SolutionsUnited States
- PhilipsNetherlands
- PhotronicsUnited States
- Powertech TechnologyTaiwan
- PSMCTaiwan
- Qnity ElectronicsUnited States
- QualcommUnited States
- Quanta ComputerTaiwan
- RambusUnited States
- RapidusJapan
- Reliance IndustriesIndia
- RenesasJapan
- ResonacJapan
- ROHMJapan
- Sahasra SemiconductorsIndia
- Samsung ElectronicsSouth Korea
- SandiskUnited States
- Sankalp SemiconductorIndia
- SanminaUnited States
- Schneider ElectricFrance
- SCREEN HoldingsJapan
- Semi-Conductor LaboratoryIndia
- Shin-Etsu ChemicalJapan
- Shinko Electric IndustriesJapan
- SibelcoBelgium
- SICCChina
- SicSemIndia
- SiemensGermany
- SiFiveUnited States
- SifyIndia
- SignalchipIndia
- SiltronicGermany
- SilvacoUnited States
- SiMa.aiUnited States
- SK hynixSouth Korea
- SK SiltronSouth Korea
- SMICChina
- SoitecFrance
- State Bank of IndiaIndia
- Stella ChemifaJapan
- STMicroelectronicsSwitzerland
- SUMCOJapan
- Sumitomo ChemicalJapan
- SupermicroUnited States
- SynopsysUnited States
- SyntiantUnited States
- Syrma SGSIndia
- TankeBlueChina
- Tata ElectronicsIndia
- Tata MotorsIndia
- TechnoprobeItaly
- Tejas NetworksIndia
- TencentChina
- TenstorrentUnited States
- TeradyneUnited States
- TeslaUnited States
- TessolveIndia
- Texas InstrumentsUnited States
- The Quartz CorpNorway
- Tokyo ElectronJapan
- Tokyo Ohka KogyoJapan
- Tower SemiconductorIsrael
- ToyotaJapan
- TRUMPFGermany
- TSMCTaiwan
- UMCTaiwan
- UTACSingapore
- Vanguard International SemiconductorTaiwan
- VAT GroupSwitzerland
- VE Commercial VehiclesIndia
- VeecoUnited States
- VolkswagenGermany
- Volvo GroupSweden
- Wacker ChemieGermany
- WalmartUnited States
- WiproIndia
- WistronTaiwan
- WiwynnTaiwan
- WolfspeedUnited States
- XiaomiChina
- YMTCChina
- YosysHQAustria
- YottaIndia
- ZEISSGermany
- ZTEChina
Sources and further reading
Written by Ayush Kapale. This guide draws on my earlier semiconductor research and the company and industry sources below. The map groups related work to make the journey easier to follow; actual production involves repeated steps and feedback.
Company names show participation, not market share. Country labels refer to headquarters, not necessarily where the work happens. Source research was checked on 3 October 2026.
Browse the source links
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- SK hynix Completes World's First HBM4 Development and Readies Mass Production : SK hynix Newsroomskhynix.com
- AI Demand Drives 4Q25 Global Top 10 Foundries Revenue Up 2.6% QoQ; Samsung Gains Share and Tower Moves Up in Rankings, Says TrendForceTrendForce · 2026-03-12
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- HBM Industry Analysis - 3Q26 | TrendForceTrendForce · 2026-08-05
- RF, DC, Mixed Signal and Optical Analytical Probes | FormFactor, Inc.formfactor.com
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- VIPack™ | ASEase.aseglobal.com
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- Bondingevgroup.com
- Packaging Applications Center of Excellence (PACE) | Onto Innovationontoinnovation.com
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- Annual Reports :: Teradyne, Inc. (TER)investors.teradyne.com
- Home | Cohucohu.com
- Semiconductor Test and Burn-in | Aehr Test Systemsaehr.com
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- Financial Performance | Dixon Technologiesdixoninfo.com
- Press Releasekaynestechnology.co.in
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- Energy demand from AI : Energy and AI : Analysis - IEAInternational Energy Agency · 2025-04-10
- Energy supply for AI : Energy and AI : Analysis - IEAInternational Energy Agency · 2025-04-10
- Executive summary : Key Questions on Energy and AI : Analysis - IEAInternational Energy Agency
- Home | India Semiconductor MissionIndia Semiconductor Mission
- Design Linked Incentive SchemeC-DAC / MeitY
- Design Linked Incentive SchemeC-DAC / MeitY
- Design Linked Incentive SchemeC-DAC / MeitY
- Approved Semiconductor Manufacturing ProjectsPress Information Bureau, Government of India
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- Micron Celebrates Opening of India's First Semiconductor Assembly and Test Facility | Micron Technologymicron.gcs-web.com · 2026-02-28
- Press Release Page | Press Information BureauPress Information Bureau, Government of India · 2026-03-31
- Press Release Page | Press Information BureauPress Information Bureau, Government of India · 2026-07-04
- Semiconductor Foundry - Tata Electronics - Tata Electronics - Tata Electronics Private Limitedtataelectronics.com
- Tata Electronics and ASML Announce Strategic Partnership to Advance the Semiconductor Manufacturing Ecosystem in India - Tata Electronics - Tata Electronics Private Limitedtataelectronics.com · 2026-05-16
- Newsroom - Tata Electronics - Tata Electronics Private Limitedtataelectronics.com
- Test Engineering Servicestessolve.com
- Semiconductor Chip Design Services - Turnkey Silicon | HCLTech UShcltech.com
- Moving into pilot production for world-leading 2nm logic chips | Rapidus Corporationrapidus.inc · 2025-04-01
- TCAD - Silvacosilvaco.com
- Synthesis in detail - YosysHQ Yosys docs-preview-ci documentationyosyshq.readthedocs.io
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- Semiconductor Industry | U.S. Department of Commercecommerce.gov
- Strengthening Europe's tech sovereignty - European Commissioncommission.europa.eu · 2026-06-03
- EAR 744 | Bureau of Industry and Securitybis.gov
- Semiconductor-Related | STELLA CHEMIFAstella-chemifa.co.jp
- Sibelco: official company and product informationSibelco
- The Quartz Corp: official company and product informationThe Quartz Corp
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- Edwards Vacuum: official business and product evidenceEdwards Vacuum
- Vanguard International Semiconductor: official business and product evidenceVanguard International Semiconductor
- DB HiTek: official business and product evidenceDB HiTek
- VE Commercial Vehicles: official business and product evidenceVE Commercial Vehicles
- Bharat Electronics: official business and product evidenceBharat Electronics
- Gujarat Semiconductor Policy 2022-27Government of India / state government
- Odisha electronics and semiconductor policiesGovernment of India / state government
- Cabinet approves Crystal Matrix and Suchi semiconductor projectsGovernment of India / state government · 2026-05-05
- India Building Semiconductor Future: September 2026 backgrounderPress Information Bureau, Government of India · 2026-09-17
- RISC-V International: open instruction-set standards and governanceRISC-V International
- JEDEC memory standards and industry coordinationJEDEC
- SIA 2026 industry report: 2025 global chip sales observationSemiconductor Industry Association · 2026-07-27
- Mapping the semiconductor value chain, June 2025OECD
- METI selection of Rapidus for semiconductor production supportMETI, Japan · 2025-11-21
- Korean power semiconductor technology, infrastructure and workforce roadmapMOTIR, Republic of Korea · 2026-04-23
- Taiwan industrial innovation support for semiconductor R&D and advanced processesMOEA, Taiwan
- China electronic information manufacturing plan for 2026-2030State Council portal / Xinhua · 2026-09-15
- Tata Electronics and Besi: Assam packaging capability partnershipTata Electronics · 2026-09-17